Distinguished Guests, Dear Colleagues in the Industry,

Welcome to DVCon China 2026! As the Chairman of this conference, I am honored to be here with all of you to discuss the latest trends and cutting- edge technologies in the field of design verification.

Over the past year, the global semiconductor industry has recovered amid fluctuations and forged ahead amid changes, entering a new development cycle centered on AIcomputing power, advanced packaging, automotive electronics, and independent controllability. The global market scale has continued to expand, with AI- driven data center chips, high- bandwidth memory, and automotive- grade semiconductors becoming the core drivers of growth. The industrial pattern is accelerating its restructuring, and the trend of multi- polarization is becoming increasingly obvious. At the same time, China's semiconductor design industry has withstood external pressures, seized domestic demand opportunities, and demonstrated distinct characteristics of structural breakthroughs, systematic upgrading, and ecological growth.

Domestically, chip R&D has continued to deepen in key areas such as AI computing power, high-end CPU/GPU, automotive electronics, industrial control, communications,and the Internet of Things (IoT), and has steadily advanced and made continuous breakthroughs in directions such as large- scale mature processes, differentiated advanced processes, Chiplet, and heterogeneous integration. Local AI chips are gradually iterating from" usable" to" high- performance" and accelerating the pace of large- scale commercialization; the localization process of automotive- grade MCUs, power devices,and sensors is steadily accelerating, with continuous improvement in product competitiveness; analog and mixed- signal chips are ushering in a period of development opportunities, with the domestic substitution process advancing in an orderly manner and broad space. We are steadily moving towards the goal of transforming from a" follower" to a" peer runner" and even a" local leader" in some areas.

With the exponential growth in chip complexity, design verification has become a key link throughout the entire chip R&D process, directly related to the success or failure of chip products, the length of R&D cycles, and the effectiveness of cost control, and its core value has become increasingly prominent. Over the past year, our team of verification engineers has continued to grow, high-quality talents have gathered at an accelerated pace, and the weight of verification work in chip R&D has also continued to increase.Combined with the core themes of the papers collected in this conference, we can clearly see that the current exploration in the field of verification has fully covered multiple key directions such as RTL verification, system-level verification, formal verification, low-power verification, automotive functional safety verification, AI chip verification, IP verification, and Chiplet interconnection verification. These are the current focus of the industry and the core areas where all colleagues are deeply engaged in practice. From the optimization of simulation tools to the iteration of verification processes, from the solution of engineering problems to the innovation of verification methodologies, every step of exploration is laying a solid foundation for the high-quality development of the chip industry.

While pursuing efficiency and quality, innovation has always been the primary driving force for industrial development. Faced with multiple challenges such as advanced processes, high computing power, high reliability, and high security, we continue to explore in architectural innovation, process innovation, tool innovation, and engineering method innovation. The papers collected in this conference also focus on showing the practical achievements and cutting-edge thinking of all colleagues in these fields.Whether it is the in-depth application of UVM methodology, the in-depth integration of AI and EDA tools, the improvement of automotive verification systems, the use of AIagents by enterprises to accelerate verification efficiency, the expanded application of formal verification in complex scenarios, or the exploration of customized verification processes by enterprises to meet their own R&D needs, every innovation achievement is inseparable from the wisdom and perseverance of every verification engineer present here. It is continuous innovation that enables us to stand firm and win the future in a complex and changing environment.

As a professionally influential conference in the field of design verification in China,DVCon China has always adhered to its original intention over the years, committed to building a high-quality platform for technical exchange, experience sharing, talent gathering, and industrial linkage, and providing an important channel for domestic design verification practitioners to exchange skills, broaden their horizons, and connect resources. Over the past year, the industry has experienced cycle switching and technological leapfrogging, and we need communication, cooperation, and mutual empowerment more than ever before. This conference has gathered experts, scholars,enterprise leaders, and engineering elites from home and abroad. Centering on the core directions of the papers collected in this conference, it has set up rich sharing sessions,including cutting-edge technology prospects, front-line practical experience, and ecological co-construction thinking. I hope that during this day, everyone can speak freely, conduct in-depth exchanges, spark ideas, and gain friendship, making progress in technology, expanding their horizons, and achieving gains in cooperation.

Once again, thank you all for your arrival, and thank all sponsors, partners, and volunteers for your strong support! I look forward to working with all of you to explore the path of verification, build the foundation of chips, and depict the future of the industry!

Finally, I wish DVCon China 2026 a complete success!

Thank you all!

Bin Liu
DVCon China 2026 General Chair