DVCon China 2023 Technical Program Committee
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TPC Chair Roman Wang
MetaX Integrated Circuits (Shanghai) Co., Ltd.
Email
- Peiyu Liu
Qualcomm Technologies, Inc.
- Stone Chen
MetaX Integrated Circuits (Shanghai) Co., Ltd.
- Yun Zhang
MetaX Integrated Circuits (Shanghai) Co., Ltd.
- Justin Wang
OPPO
- Mike Nan
AMD
- MingJie Wu
Unisoc Communications, Inc.
- David Zhang
Cadence Design Systems, Inc.
- Ricky Yang
Siemens EDA
- Leo Fang
Synopsys, Inc.
- Bill Fu
Realtek Semiconductor Corp.
- Shujun Hou
Nurlink
- Bin Liu
Rocker IC
- Alex Peng
T-HEAD
- Jia Tian
GigaDevice
- Alex Wan
NXP Semiconductors
- Gaoxue Xu
Hisilicon
- Deyong Yang
Unisoc Communications, Inc.
- Fan Yang
Fudan University
- Baodong Yu
SiengineTechnology
- Alex Zhang
Qualcomm Technologies, Inc.
- Landy Zhang
DJI
- Xufeng Zhang
Unisoc Communications, Inc.
- Tianfang Zhang
Pingtouge
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