15 April 2020

Shanghai, China

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DVCon China 2020

Welcome message from the General Chair

 

   Bin Liu
   DVCon China 2020 General Chair
 

 
I am honored to be the chairman of the 4th DVCon China again, and together with the members of the organizing committee, provide IC industry engineers from all over the country with a platform for technical exchanges.
 
The DVCon China 2019 conference was very successful. We received more papers than before, and we received more attention and recognition from the industry. We hope to inject the successful conference experience into the preparation work for next year's conference.
 
While new products appear in the IC market, we have received more diversified solutions in the chip verification solution. For example, testbench automation and test vector automation solutions are improving verification efficiency, and the coverage consistency requirement also makes the coverage integration of the formal and the simulation faster.
 
However, we find that the complexity and the efficiency gap of verification are still expanding. We are introducing new tools and methods to make up for these gaps, but in addition to engineers needing to learn to master new tools and methods, we are also considering how to make new solutions improve the efficiency of verification and no longer bring new workload to engineers.
 

Conference Details

DVCon China 2020 Call for Abstract Submissions Now Open!

View Call for Abstracts Information

 


2019 Best Paper and Best Poster Award

Best Paper

3.1 - The Power Of Testbench Automation Shortening the Verification Gap For IP Integration

Speaker: Yan Wu - Intel Corp.

Authors:
Yan Wu - Intel Corp.
Yaping Yue - Intel Corp
Wei Ma - Intel Corp.

Best Poster

7.9 A SystemC RTL Co-sim Platform for Architecture Exploration

Speaker: Chenguang Guo - Allwinner Tech.

Authors:
Chenguang Guo - Allwinner Tech.
Yibo Liu - Allwinner Tech.
Hao Feng - Allwinner Tech.
Zhe Chen - Allwinner Tech.